Mask Aligner

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Instrument name

Mask Aligner

Model

MJB4

Manufacturer

SUSS Micro Tec Lithography GmbH

Specifications

Substrate Size4” * 4” (100 mm) diameter substrate

Substrate thickness: Up to 4 mm diameter

Mask Size: from 2” * 2” to 5” * 5”

Light Source: 500 W mercury lamp

Support Constant Light Intensity or Constant Power Mode

Resolution: Soft Contact Mode could realize 2 um structure

Hard Contact Mode could realize 1 um structure

Vacuum Contact Mode could realize 0.5 um structure


Applications and Uses

The machine is exclusively intended for use as an alignment and /or exposure device for substrates used in semiconductor and micro system technology.

Accessories

Damping workbench

Contact

Wenchang Zhu

Tel

15301453461

E-mail

wczhu@suda.edu.cn


Editor: Wenchang Zhu

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