题目:Recent Progress and Future Opportunities for Hot Carrier Photodetectors: From Ultraviolet to Infrared Bands
作者:Cheng Zhanga,b, Yu Luoc, Stefan A. Maierd,e,f, Xiaofeng Lia,b,*
单位:
aSchool of Optoelectronic Science and Engineering and CollaborativeInnovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou 215006, China
bKey Lab of Advanced Optical Manufacturing Technologies of JiangsuProvince and Key Lab of Modern Optical Technologies of EducationMinistry of China,Soochow UniversitySuzhou 215006, China
cSchool of Electrical and Electronic EngineeringNanyang Technological University, Nanyang Avenue, Singapore 639798, Singapore
dSchool of Physics and Astronomy,Monash University,Clayton Victoria 3800, Australia
eThe Blackett Laboratory, Department of Physics, Imperial College London, London SW7 2AZ, UK
fChair in Hybrid Nanosystems,Nanoinstitut München, Fakultät für Physik,Ludwig-Maximilians-Universität München,München 80539, Germany
摘要:The hot carriers generated from the nonradiative decay of surface plasmons in metallic nanostructures can inject into the conduction band of a semiconductor, allowing for the sub-bandgap photodetection under room temperature. By the controllable interfacial barrier height between the plasmonic and semiconductor/insulator materials, the hot carrier photodetectors working from ultraviolet to infrared bands are extensively demonstrated with significant progress. In this review, hot carrier dynamics are briefly discussed from generation, transport, and emission perspectives. The state-of-the-art progress of hot carrier photodetectors with various configurations, material constitutions, and plasmonic nanostructures are surveyed. To further promote hot carrier extraction efficiency toward the practical applications, the thermodynamic loss analysis, and the potential strategies from the optical, electrical, and material perspectives are addressed. The performances of the developed hot carrier photodetectors are also summarized, particularly addressing the novel functionalities, challenges, and future opportunities.
影响因子:13.138
链接:https://doi.org/10.1002/lpor.202100714